Market Highlights:
HDI PCB have a higher circuitry density than a traditional PCB, which means it allows designers to place more components on an HDI PCB. Shorter distance between the electronic components and smaller size of the components help in reduced signal loss and crossing delays, resulting into faster transmission of signals from one part to another.
The increasing need for smaller, energy-efficient, and high-performance PCBs acts as the major driving factor for the growth of HDI PCB market globally. This has helped the overall electronics industry to produce smarter, lighter, faster, and smaller products. For instance, in the last two decades, the cellular mobile phone market has experienced tremendous innovation, from simple monochromic display and basic voice call capability to feature rich computing device with high-resolution touch screen, camera, fast internet connectivity, GPS, music player, and many more. Similarly, heavy desktop computers during 1990s are now advanced to faster and smaller laptops with the help of HDI PCBs. Despite major developments, the high cost associated with manufacturing and lack of expertise in manufacturing are hampering the market growth.
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Major Key players
- Epec, LLC (US),
- TTM Technologies (US),
- PCBCART (China),
- Millennium Circuits Limited (US),
- RAYMING (China),
- Mistral Solutions Pvt. Ltd. (India),
- SIERRA CIRCUITS, INC. (US),
- Advanced Circuits (US),
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED (Japan),
- FINELINE Ltd. (Israel),
- Austria Technologie & Systemtechnik Aktiengesellschaft (Austria)
Globally, the High-Density Interconnect (HDI) Printed Circuit Board (PCB) Market is expected to grow from USD 8,683.9 million in 2018 to USD 15,600.6 million by 2023, at a CAGR of 12.4% during the forecast period, 2018–2013.
Competitive Analysis
The HDI PCB market offers tremendous new opportunity as well as intense competiton. The nature of the electronics industry creates a competitive landscape that is continuously evolving, emerging, and expanding. To meet the dynamic requirements of the customers, the major vendors are majorly focusing on new product development through increased investments in research & development (R&D) activities or through acqusitions. According to the latest trends in the HDI PCB market, more number of acquisitions are expected in the market
Regional Analysis
The global market for global HDI PCB is estimated to grow at a significant rate during the forecast period from 2018 to 2023. The geographical analysis of the market is studied for North America, Europe, Asia-Pacific, and the rest of the world.
North America is presumed to have significant growth in the HDI PCB market. The US and Canada are the leading countries in the region. The growth is attributed to increase in demand for wearable devices in the healthcare sectors and high demand in the automotive sector. Asia Pacific is also anticipated to be the fastest growing region in the HDI PCB market over the forecast period. India, Japan, South Korea, and China are the leading countries in the HCI PCB market. This is due to the presence of a large number of electronics and semiconductor manufacturers in the region and wide usage of consumer electronics products in the region.
Segmentation.
The global HDI PCB Market is segmented into number of high-density interconnection layer, industry vertical, and regions/country.
By number of high density interconnection layer, the market is segmented into 1, 2, and all.
By industry vertical, the market is segmented into consumer electronics, military and defense, telecom and IT, automotive, manufacturing, medical devices, and others.
By region, the market is segmented into North America, Europe, Asia-Pacific, and rest of the world.
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Intended Audience
- HDI PCB manufacturers
- Electronic product manufacturers
- Resellers and Distributors
- Standard Making Bodies and Associations
- Automotive and Manufacturing Industries
- Custom electronic product developers
LIST OF TABLES
Table 1 Global High-Density Interconnect PCB Market, By Region, 2018-2023
Table 2 North America High-Density Interconnect PCB Market, By Country, 2018-2023
Table 3 Europe High-Density Interconnect PCB Market, By Country, 2018-2023
Table 4 Asia-Pacific High-Density Interconnect PCB Market, By Country, 2018-2023
Table 5 Rest of the World High-Density Interconnect PCB Market, By Country, 2018-2023
Table 6 North America High-Density Interconnect PCB Market, By Industry Vertical, By Country, 2018-2023
Continued…….
LIST OF FIGURES
FIGURE 1 Global High-Density Interconnect PCB Market: Segmentation
FIGURE 2 Forecast Methodology
FIGURE 3 Porter’s Five Forces Analysis of Global High-Density Interconnect PCB Market
FIGURE 4 Value Chain of Global High-Density Interconnect PCB Market
FIGURE 5 Share of Global High-Density Interconnect PCB Market by Country, 2017
Continued…….
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