Lucintel’s latest market report analyzed that low dielectric resin provides attractive opportunities in the PCB, wire & cable, antenna, microelectronics, and radome applications. The low dielectric resin market is expected to grow at a CAGR of 4.3%. In this market, fluoropolymer is the largest segment by resin type, whereas PCB is largest by application. The increasing uses of low dielectric resin in microfluidic chips for medical device and low dielectric resin in high speed PCBs for low signal loss and high frequency provides strategic growth path in this market.
Download Brochure of this report by clicking on https://www.lucintel.com/low-dielectric-resin-market.aspx Based on resin type, the low dielectric resinmarket is segmented into fluoropolymer, cyanate ester, cyclic olefin copolymer, m-PPE, polyimide, PET, and others. The fluoropolymer segment accounted for the largest share of the market in 2020 and is expected to register the highest CAGR during the forecast period supported by increase in demand for high performance PCB, wire & cable, and antenna applications.
Browse in-depth TOC on “Low Dielectric Resin Market”
125 – Tables
148 – Figures
226– Pages
The low dielectric resin market is marked by the presence of several big and small players. Some of the prominent players offering low dielectric resin include Huntsman, Lonza Group, Zeon, SABIC, and Chemours and others.
This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link helpdesk@lucintel.com.
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