Lucintel’s latest market report analyzed that wafer level packaging in the global OSAT provides attractive opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial applications. The wafer level packaging in the global OSAT market is expected to reach $2.1 billion by 2028 with a CAGR of 9.4%. In this market, assembly & packaging is the largest segment by service type, whereas consumer electronics is largest by application.
Based on service type, the wafer level packaging in the global OSAT market is segmented into assembly & packaging and testing. The assembly & packaging segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to the growing trend for electrical devices that are compact, high-performing and inexpensive.
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The Wafer Level Packaging in the Global OSAT Market is marked by the presence of several big and small players. Some of the prominent players offering wafer level packaging in the global OSAT include ASML Holding, Fujitsu, Toshiba, Qualcomm, and Amkor Technology.
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