Lucintel’s latest market report analyzed that computer & networking OSAT provides attractive opportunities in the assembly & packaging and testing markets. The computer & networking OSAT market is expected to reach $8.3 billion by 2028 with a CAGR of 17.9%. In this market, wire bond is the largest segment by packaging type, whereas assembly & packaging is largest by service type.
Based on packaging type, the computer & networking OSAT market is segmented into wire bond, flip chip, wafer level, and others. The wire bond segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to the extensive use of wire bond packaging in computer & networking applications.
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The Computer & Networking OSAT Market is marked by the presence of several big and small players. Some of the prominent players offering computer & networking OSAT include Advanced Semiconductor, Amkor, Jiangsu Changjiang Electronics Technology (JCET), Siliconware Precision Industries, and PTI.
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