Lucintel’s latest market report analyzed that epoxy resin PCB laminate provides attractive opportunities in the communication, consumer electronic, computer/peripheral, military/aerospace, industrial electronic, and automotive markets The epoxy resin PCB laminate market is expected to reach $1.68 billion by 2028 with a CAGR of 8.1%. In this market, liquid is the largest segment by physical form, whereas consumer electronics is largest by application.
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Based on physical form, the epoxy resin PCB laminate market is segmented into solid, liquid, solution, and solvent cut epoxy. The liquid segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, as it provides stability for longer period of time at room temperature and also has superior properties, such as dimensional stability during cure, chemical resistance, chemical inertness, durability, and superior adhesion.
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The Epoxy Resin PCB Laminate Market is marked by the presence of several big and small players. Some of the prominent players offering epoxy resin PCB laminate include Nippon Mektron, Samsung Electro-Mechanics, Unimicron Technology, Young Poong Electronics, Zhen Ding Technology Holding, BASF, Solvay, Huntsman International, 3M, and Olin Corporation.
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