Ball Grid Array (BGA) Package Industry

Description

A Ball Grid Array or BGA package is a form of surface mount technology, or SMT package that is being used increasingly for integrated circuits.. The Ball Grid Array, BGA, uses a different approach to the connections to that used for more conventional surface mount connections. Other packages such as the quad flat pack, QFP, used the sides of the package for the connections. This meant that there was limited space for the pins which had to be spaced very closely and made much smaller to provide the required level of connectivity. The Ball Grid Array, BGA, uses the underside of the package, where there is a considerable area for the connections. 

The Ball Grid Array, BGA package was developed out of the need to have a more robust and convenient package for integrated circuits with large numbers of pins. With the levels of integration rising, some integrated circuits had in excess of 100 pins. 
In 2018, the global Ball Grid Array (BGA) Package market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.

This report focuses on the global Ball Grid Array (BGA) Package status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Ball Grid Array (BGA) Package development in United States, Europe and China.

The key players covered in this study 

Intel 
NexLogic Technologies 
Texas Instruments 
Palomar Technologies 
Micro Systems Technologies 
Sonix 
Advanced Interconnections Corp 
…

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Market segment by Type, the product can be split into 
Common BGA package 
Flip Chip BGA Package

Market segment by Application, split into 
PCBs 
Other

Market segment by Regions/Countries, this report covers 
United States 
Europe 
China 
Japan 
Southeast Asia 
India 
Central & South America

The study objectives of this report are: 
To analyze global Ball Grid Array (BGA) Package status, future forecast, growth opportunity, key market and key players. 
To present the Ball Grid Array (BGA) Package development in United States, Europe and China. 
To strategically profile the key players and comprehensively analyze their development plan and strategies. 
To define, describe and forecast the market by product type, market and key regions.

Table of Contents

1 Report Overview 
1.1 Study Scope 
1.2 Key Market Segments 
1.3 Players Covered 
1.4 Market Analysis by Type 
1.4.1 Global Ball Grid Array (BGA) Package Market Size Growth Rate by Type (2014-2025) 
1.4.2 Common BGA package 
1.4.3 Flip Chip BGA Package 
1.5 Market by Application 
1.5.1 Global Ball Grid Array (BGA) Package Market Share by Application (2014-2025) 
1.5.2 PCBs 
1.5.3 Other 
1.6 Study Objectives 
1.7 Years Considered

2 Global Growth Trends 
2.1 Ball Grid Array (BGA) Package Market Size 
2.2 Ball Grid Array (BGA) Package Growth Trends by Regions 
2.2.1 Ball Grid Array (BGA) Package Market Size by Regions (2014-2025) 
2.2.2 Ball Grid Array (BGA) Package Market Share by Regions (2014-2019) 
2.3 Industry Trends 
2.3.1 Market Top Trends 
2.3.2 Market Drivers 
2.3.3 Market Opportunities

….

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12 International Players Profiles 
12.1 Intel 
12.1.1 Intel Company Details 
12.1.2 Company Description and Business Overview 
12.1.3 Ball Grid Array (BGA) Package Introduction 
12.1.4 Intel Revenue in Ball Grid Array (BGA) Package Business (2014-2019) 
12.1.5 Intel Recent Development 
12.2 NexLogic Technologies 
12.2.1 NexLogic Technologies Company Details 
12.2.2 Company Description and Business Overview 
12.2.3 Ball Grid Array (BGA) Package Introduction 
12.2.4 NexLogic Technologies Revenue in Ball Grid Array (BGA) Package Business (2014-2019) 
12.2.5 NexLogic Technologies Recent Development 
12.3 Texas Instruments 
12.3.1 Texas Instruments Company Details 
12.3.2 Company Description and Business Overview 
12.3.3 Ball Grid Array (BGA) Package Introduction 
12.3.4 Texas Instruments Revenue in Ball Grid Array (BGA) Package Business (2014-2019) 
12.3.5 Texas Instruments Recent Development 
12.4 Palomar Technologies 
12.4.1 Palomar Technologies Company Details 
12.4.2 Company Description and Business Overview 
12.4.3 Ball Grid Array (BGA) Package Introduction 
12.4.4 Palomar Technologies Revenue in Ball Grid Array (BGA) Package Business (2014-2019) 
12.4.5 Palomar Technologies Recent Development 
12.5 Micro Systems Technologies 
12.5.1 Micro Systems Technologies Company Details 
12.5.2 Company Description and Business Overview 
12.5.3 Ball Grid Array (BGA) Package Introduction 
12.5.4 Micro Systems Technologies Revenue in Ball Grid Array (BGA) Package Business (2014-2019) 
12.5.5 Micro Systems Technologies Recent Development 
12.6 Sonix 
12.6.1 Sonix Company Details 
12.6.2 Company Description and Business Overview 
12.6.3 Ball Grid Array (BGA) Package Introduction 
12.6.4 Sonix Revenue in Ball Grid Array (BGA) Package Business (2014-2019) 
12.6.5 Sonix Recent Development 
12.7 Advanced Interconnections Corp 
12.7.1 Advanced Interconnections Corp Company Details 
12.7.2 Company Description and Business Overview 
12.7.3 Ball Grid Array (BGA) Package Introduction 
12.7.4 Advanced Interconnections Corp Revenue in Ball Grid Array (BGA) Package Business (2014-2019) 
12.7.5 Advanced Interconnections Corp Recent Development

Continued…            

Also Read – Global Self-Healing Grid Market Research Report 2019

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