Lucintel’s latest market report analyzed that glass fabric PCB laminate provides attractive opportunities in the communication, consumer electronic, computer/peripheral, military/aerospace, industrial electronic, and automotive markets. The glass fabric PCB laminate market is expected to reach $1.68 billion by 2028 with a CAGR of 8.9%. In this market, woven is the largest segment by fabric type, whereas consumer electronic is largest by end use Industry.
Based on fabric type, the glass fabric PCB laminate market is segmented into woven and non-woven. The woven segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, because it is lightweight and provides better durability, reliability, and better resistance to moisture and weather.
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The Glass Fabric PCB Laminate Market is marked by the presence of several big and small players. Some of the prominent players offering glass fabric PCB laminate include Samsung Electro-Mechanics, Unimicron Technology, Young Poong Electronics, Zhen Ding Technology Holding, Owens Corning, Saint-Gobain Vetrotex, Johns Manville, Nippon Electric Glass, Asahi Kasei Corporation, China Jushi.
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