This report studies the global TCB Bonder market status and forecast, categorizes the global TCB Bonder market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, and other regions (India, Southeast Asia, Central & South America, and Middle East & Africa).

Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called “Thermo Compression Bonding”. The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.

Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global TCB Bonder market is driven by increased TCB Bonder usage: memory applications currently, logic devices next. Meanwhile, TCB Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.

The leading enterprises in the TCB Bonder market are ASMPT (AMICRA) (HK) and K&S (US), which followed by Besi (NL), Shibaura (JP), SET (FR), and Hanmi (KR). These Top companies currently account for more than 91.03% of the total market share and are expected to retain their dominating hold over the market during the forecast period.

North America TCB Bonder market would keep being the largest market, followed by Europe in 2018. Japan market and China market would rank forth (12 units) and fifth (11 units).

The global TCB Bonder market is valued at 33 million US$ in 2017 and will reach 140 million US$ by the end of 2025, growing at a CAGR of 20.0% during 2018-2025.

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The major manufacturers covered in this report

    ASMPT (Amicra)

    K&S

    BESI

    Shibaura

    SET

    Hamni

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering

    North America

    Europe

    China

    Japan

    Southeast Asia

    India 

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into

    Automatic TCB Bonder

    Manual TCB Bonder

On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including

    IDMs

    OSAT 

Table of Contents:

Chapter 1: Global TCB BONDER Market Overview

Overview and Scope of global TCB BONDER Market

Global TCB BONDER Market Sales and Market Share

Sales and Growth Comparison of global TCB BONDER Market

Global TCB BONDER Market by Regions

Chapter 2: Global TCB BONDER Market segments

Global TCB BONDER Sales and Revenue by applicants

Global TCB BONDER Market Competition by Players

Global TCB BONDER Market by product segments

Global TCB BONDER Sales and Revenue by Type

Chapter 3:  Global TCB BONDER Market marketing channel

 Marketing Strategy Analysis, Distributors/Traders

Direct Marketing

Marketing channel trend and development

….Continued

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