This report provides detailed analysis of worldwide markets for HDI Printed Circuit Board from 2011-2016, and provides extensive market forecasts (2016-2021) by region/country and subsectors. It covers the key technological and market trends in the HDI Printed Circuit Board market and further lays out an analysis of the factors influencing the supply/demand for HDI Printed Circuit Board, and the opportunities/challenges faced by industry participants. It also acts as an essential tool to companies active across the value chain and to the new entrants by enabling them to capitalize the opportunities and develop business strategies.
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HDI is the abbreviation for High Density Interconnector. HDI PCB, one of the fastest growing technologies in PCBs, are now available at Epec. HDI PCBs contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards. HDI PCB is made through Microvia and buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing. HDI PCB is the best alternative to high layer-countand expensive standard laminate or sequentially laminated boards.
Global HDI Printed Circuit Board Market Forecast and Analysis 2016-2021, has been prepared based on the synthesis, analysis, and interpretation of information about the global HDI Printed Circuit Board market collected from specialized sources. The report covers key technological developments in the recent times and profiles leading players in the market and analyzes their key strategies. The competitive landscape section of the report provides a clear insight into the market share analysis of key industry players. The major players in the global HDI Printed Circuit Board market areUnimicron, COMPEQ, AT&S, TTM, Zhen Ding, Ibiden, Tripod, Unitech.
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The report provides separate comprehensive analytics for the North America, Europe, Asia-Pacific, Middle East and Africa and Rest of World. In this sector, global competitive landscape and supply/demand pattern of HDI Printed Circuit Board industry has been provided.
Table of Contents
Part 1. Scope of Report
1.1 Research Methodology
1.2 Geographic Scope
1.3 Years Considered
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Part 2. Introduction
2.1 Key Findings
2.2 Value Chain Analysis
2.2.2 Upstream
2.2.3 Downstream
Part 3. Manufacture
3.1 Manufacturing Process
3.2 Issues and Trends
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