Semiconductor Metallization and Interconnects Market 2019
Semiconductor metallization is an integral part of semiconductor manufacturing. Metallization, the final step in the wafer processing sequence, is the process by which the components of integrated circuits are interconnected by an aluminum conductor. This process produces a thin-film metal layer that will serve as the required conductor pattern for the interconnection of the various components on the chip.
In 2018, the global Semiconductor Metallization and Interconnects market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2019-2025.
This report focuses on the global Semiconductor Metallization and Interconnects status, future forecast, growth opportunity, key market and key players. The study objectives are to present the Semiconductor Metallization and Interconnects development in United States, Europe and China.
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The key players covered in this study
Amkor Technology Inc.
At&S
Atotech Deutschland Gmbh
Aveni Inc.
China Wafer Level Csp Co. Ltd.
Chipbond Technology Corp.
Chipmos Technologies Inc.
Deca Technologies Inc.
Fujitsu Ltd.
Insight Sip
International Quantum Epitaxy Plc
Jiangsu Changjiang Electronics Technology Co. Ltd.
Kokomo Semiconductors
Nanium S.A.
Nemotek Technologie
Powertech Technology Inc.
Qualcomm Inc.
Siliconware Precision Industries Co. Ltd.
Stats Chippac Ltd.
Suss Microtec
Toshiba Corp.
Triquint Semiconductor Inc.
Unisem
Market segment by Type, the product can be split into
Filament Evaporation
Electron-Beam Evaporation
Flash Evaporation
Induction Evaporation
Sputtering
Others
Market segment by Application, split into
Consumer Electronics
Automotive
Defense And Aerospace
Medical
Industrial
Others
Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India
Central & South America
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Table of Contents –Analysis of Key Points
1 Report Overview
1.1 Study Scope
1.2 Key Market Segments
1.3 Players Covered
1.4 Market Analysis by Type
1.4.1 Global Semiconductor Metallization and Interconnects Market Size Growth Rate by Type (2014-2025)
1.4.2 Filament Evaporation
1.4.3 Electron-Beam Evaporation
1.4.4 Flash Evaporation
1.4.5 Induction Evaporation
1.4.6 Sputtering
1.4.7 Others
1.5 Market by Application
1.5.1 Global Semiconductor Metallization and Interconnects Market Share by Application (2014-2025)
1.5.2 Consumer Electronics
1.5.3 Automotive
1.5.4 Defense And Aerospace
1.5.5 Medical
1.5.6 Industrial
1.5.7 Others
1.6 Study Objectives
1.7 Years Considered
2 Global Growth Trends
2.1 Semiconductor Metallization and Interconnects Market Size
2.2 Semiconductor Metallization and Interconnects Growth Trends by Regions
2.2.1 Semiconductor Metallization and Interconnects Market Size by Regions (2014-2025)
2.2.2 Semiconductor Metallization and Interconnects Market Share by Regions (2014-2019)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers
2.3.3 Market Opportunities
……….
12 International Players Profiles
12.1 Amkor Technology Inc.
12.1.1 Amkor Technology Inc. Company Details
12.1.2 Company Description and Business Overview
12.1.3 Semiconductor Metallization and Interconnects Introduction
12.1.4 Amkor Technology Inc. Revenue in Semiconductor Metallization and Interconnects Business (2014-2019)
12.1.5 Amkor Technology Inc. Recent Development
12.2 At&S
12.2.1 At&S Company Details
12.2.2 Company Description and Business Overview
12.2.3 Semiconductor Metallization and Interconnects Introduction
12.2.4 At&S Revenue in Semiconductor Metallization and Interconnects Business (2014-2019)
12.2.5 At&S Recent Development
12.3 Atotech Deutschland Gmbh
12.3.1 Atotech Deutschland Gmbh Company Details
12.3.2 Company Description and Business Overview
12.3.3 Semiconductor Metallization and Interconnects Introduction
12.3.4 Atotech Deutschland Gmbh Revenue in Semiconductor Metallization and Interconnects Business (2014-2019)
12.3.5 Atotech Deutschland Gmbh Recent Development
12.4 Aveni Inc.
12.4.1 Aveni Inc. Company Details
12.4.2 Company Description and Business Overview
12.4.3 Semiconductor Metallization and Interconnects Introduction
12.4.4 Aveni Inc. Revenue in Semiconductor Metallization and Interconnects Business (2014-2019)
12.4.5 Aveni Inc. Recent Development
12.5 China Wafer Level Csp Co. Ltd.
12.5.1 China Wafer Level Csp Co. Ltd. Company Details
12.5.2 Company Description and Business Overview
12.5.3 Semiconductor Metallization and Interconnects Introduction
12.5.4 China Wafer Level Csp Co. Ltd. Revenue in Semiconductor Metallization and Interconnects Business (2014-2019)
12.5.5 China Wafer Level Csp Co. Ltd. Recent Development
12.6 Chipbond Technology Corp.
12.6.1 Chipbond Technology Corp. Company Details
12.6.2 Company Description and Business Overview
12.6.3 Semiconductor Metallization and Interconnects Introduction
12.6.4 Chipbond Technology Corp. Revenue in Semiconductor Metallization and Interconnects Business (2014-2019)
12.6.5 Chipbond Technology Corp. Recent Development
12.7 Chipmos Technologies Inc.
12.7.1 Chipmos Technologies Inc. Company Details
12.7.2 Company Description and Business Overview
12.7.3 Semiconductor Metallization and Interconnects Introduction
12.7.4 Chipmos Technologies Inc. Revenue in Semiconductor Metallization and Interconnects Business (2014-2019)
12.7.5 Chipmos Technologies Inc. Recent Development
12.8 Deca Technologies Inc.
12.8.1 Deca Technologies Inc. Company Details
12.8.2 Company Description and Business Overview
12.8.3 Semiconductor Metallization and Interconnects Introduction
12.8.4 Deca Technologies Inc. Revenue in Semiconductor Metallization and Interconnects Business (2014-2019)
Continued…..
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