Semiconductor Packaging Material Market Synopsis
Semiconductor packaging materials are used to safeguard the semiconductors from damage and increase its life span. The report presented by Market Research Future (MRFR) asserts that the global semiconductor packaging material market is set to strike 5% CAGR over the assessment period 2017 to 2023.
Changing trends in the semiconductor industry are likely to boost the growth pattern of the market in the years to come. For instance, the rising adoption of miniaturized electronics has led to the development of innovative semiconductors. This, in turn, is anticipated to facilitate innovations in the semiconductor packaging material market, thus, supporting its growth.
Increasing demand for semiconductors from the end-user industries is likely to support an exponential increase in its production levels. It is expected to drive the growth pace of the semiconductor packaging material market over the next few years. Also, technological advancements are anticipated to catalyze market growth in the forthcoming years.
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Competitive Dashboard
- Henkel AG & Company, KGaA (Germany)
- Sumitomo Chemical Co., Ltd. (Japan)
- Hitachi Chemical Company, Ltd. (Japan)
- Kyocera Chemical Corporation (Japan)
- E. I. du Pont de Nemours and Company (U.S.)
- Toray Industries, Inc. (Japan)
- Mitsui High-tec, Inc. (Japan)
- Alent plc (U.K.)
- Nippon Micrometal Corporation (Japan)
- BASF SE (Germany)
- LG Chem (South Korea)
- Tanaka Kikinzoku Group (Japan)
- Honeywell International Inc. (U.S.)
- Toppan Printing Co., Ltd. (Japan)
- Alpha Advanced Materials (U.S.)
are few of the noted players participating in the global semiconductor packaging material market. These players are presumed to invest in technological innovations to keep up with the dynamic changes in the semiconductor industry. This, in turn, is projected to encourage healthy competition among the key players over the next couple of years.
Industry News
In June 2019, Japan has imposed regulations controlling the export of the key semiconductor materials.
In August 2019, JSR Micro, an innovator in semiconductor materials solutions, has invested USD 100 Mn in the construction of a new semiconductor facility in Oregon, US. The new plant will be focusing on increasing the complexity of technology.
Market Segmentation
The segments of the global semiconductor packaging material market, based on type, identified in this report are organic substrates, encapsulation resins, bonding wires, ceramic packages, wafer level packaging dielectrics, solder balls, and others. Among these, the organic substrates segment is likely to hold the dominant share of the global market over the next couple of years. These materials form the base layer of semiconductors and support the addition of other layers. Thus, it is expected to witness substantial demand across the valuation period.
By technology, the segmental analysis of the semiconductor packaging material market covers – grid array, small outline package, quad flat package, dual flat no-leads, dual in-line package, and others. Among these, the grid array segment is held the maximum share of the market in 2016. It is anticipated to register a relatively higher CAGR through the assessment period. It exhibits a wide range of application across the semiconductor industry, which is likely to drive the proliferation of the segment in the forthcoming years.
Global Semiconductor Packaging Material Market – Regional Analysis
The regional assessment of the global semiconductor packaging material market identified four key regions, viz. North America, Asia Pacific (APAC), Europe, and the Middle East & Africa (MEA). Asia Pacific is anticipated to lead the expansion of the global market over the next couple of years. Increasing demand from the electrical & electronics industry is anticipated to facilitate the growth of the semiconductor packaging material market in the nearby future. Rapid technological developments being adopted in the region is also prognosticated to open growth avenues for market players over the next couple of years.
Table Of Contents
1 Executive Summary
2 Scope Of The Report
2.1 Market Definition
2.2 Scope Of The Study
2.2.1 Definition
2.2.2 Research Objective
2.2.3 Assumptions
2.2.4 Limitations
2.3 Research Type
2.3.1 Primary Research
2.3.2 Secondary Research
2.4 Market Size Estimation
2.5 Forecast Model
3 Market Landscape
3.1 Porter’s Five Forces Analysis
3.1.1 Threat Of New Entrants
3.1.2 Bargaining Power Of Buyers
3.1.3 Threat Of Substitutes
3.1.4 Segment Rivalry
3.1.5 Bargaining Power Of Buyers
3.2 Value Chain/Supply Chain Analysis
4 Market Dynamics
4.1 Introduction
4.2 Market Drivers
4.3 Market Restraints
4.4 Market Opportunities
4.5 Market Trends
Continues….
List Of Tables
Table 1 Global Semiconductor Packaging Material Market: By Region, 2017-2023
Table 2 North America Semiconductor Packaging Material Market: By Country, 2017-2023
Table 3 Europe Semiconductor Packaging Material Market: By Country, 2017-2023
Table 4 Asia-Pacific Semiconductor Packaging Material Market: By Country, 2017-2023
Table 5 RoW Semiconductor Packaging Material Market: By Country, 2017-2023
Table 6 Global Semiconductor Packaging Material Market, By Type, By Regions, 2017-2023
Continues…..
List Of Figures
FIGURE 1 RESEARCH TYPEOF MRFR
FIGURE 2 TOP DOWN & BOTTOM UP APPROACH
FIGURE 3 Market Dynamics
FIGURE 4 Impact Analysis: Market Drivers
FIGURE 5 Impact Analysis: Market Restraints
FIGURE 6 Porter’s Five Forces Analysis
Continues…..
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