Lucintel’s latest market report analyzed that thin film semiconductor deposition provides attractive opportunities in the chemical vapor deposition, physical vapor deposition, and atomic layer deposition applications. The thin film semiconductor deposition market is expected to reach $15.3 billion by 2028 with a CAGR of 14%. In this market, chemical vapor deposition (CVD) is the largest segment by product type, whereas integrated circuits (ICs) is largest by application.
Based on product type, the thin film semiconductor deposition market is segmented into chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD). The chemical vapor deposition (CVD) segment accounted for the largest share of the market in 2023 and is expected to register the highest CAGR during the forecast period, due to the growing usage of CVD in electronic devices and microelectronic components owing to its easier procedure for depositing thick films more quickly.
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The Thin Film Semiconductor Deposition Market is marked by the presence of several big and small players. Some of the prominent players offering thin film semiconductor deposition include Oerlikon Balzers, Hitachi Kokusai Electric, Tokyo Electron, Applied Materials, and CVD Equipment.
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